Global Photonics Integrated Circuit (PIC) Market Outlook, 2026 with Profiles of 98 Key Players Including Broadcom, Ciena, Intel, NeoPhotonics and Nokia Networks –

DUBLIN–(BUSINESS WIRE)–The “Photonic Integrated Circuit (PIC) – Global Market Trajectory & Analytics” report has been added to from offer.

Global Photonic Integrated Circuit (PIC) Market to Reach US$2.9 Billion by 2026

The market is expected to register significant growth driven by growing interest in the ability to harness the properties of light to transmit information at speeds millions of times faster than copper or laser, especially in the context of insatiable need for bandwidth and communication speeds. . The growing opportunity in optical communications and improved investment post COVID-19 bodes well for the growth of PICs.

While the continued strong growth in the deployment and expansion of communication networks with fiber optic infrastructure creates strong momentum for PICs, the increased use of fiber optics in signal transmission, sensing and biophotonics creates a very conducive environment for the growth and proliferation of PICs, on a larger scale.

The dramatic growth of the telecommunications and datacom verticals over the past 5-6 years, driven by a sharp increase in the number of Internet users and ownership rates of IP-enabled devices, and the As a result of increasing investments in deploying advanced communication networks such as 100G, 200G and 400G networks are instilling strong growth opportunities for PICs.

Amid the COVID-19 crisis, the global Photonic Integrated Circuit (PIC) Market estimated at US$870.2 Million in 2020 is expected to reach a revised size of US$2.9 Billion by 2026 , growing at a CAGR of 21.7% over the analysis period. Hybrid integration, one of the segments analyzed in the report, is expected to grow at a CAGR of 20.2% to reach US$1.7 billion by the end of the analysis period.

After a thorough analysis of the business implications of the pandemic and its induced economic crisis, the growth of the monolithic integration segment is readjusted to a revised CAGR of 25.5% for the next 7-year period. This segment currently accounts for a 29.7% share of the global photonic integrated circuit (PIC) market. Monolithic integration is gaining momentum as a major integration model for PIC assembly.

Hybrid integration represents the most widely used integration model for PICs. Hybrid PIC integration makes it easy to assemble multiple single-function optical devices into a single common package. Monolithic integration typically allows the consolidation of multiple devices as well as functions into a single common photonic material in a more convenient way than packaging or hybrid integration.

The US market is estimated at $386.7 million in 2021, while China is expected to reach $385.3 million by 2026

The photonic integrated circuit (PIC) market in the United States is estimated to be worth US$386.7 million in 2021. The country currently accounts for a 38% share of the global market. China, the world’s second largest economy, is expected to reach an estimated market size of US$385.3 million in 2026 growing at a CAGR of 34.5% over the analysis period.

Other noteworthy geographic markets include Japan and Canada, each forecasting growth of 16.2% and 18.7% respectively over the analysis period. In Europe, Germany is expected to grow at a CAGR of approximately 18.4%, while the rest of the European market (as defined in the study) will reach US$522.7 million by the end of the year. analysis period.

Increased demand for integration in smart gadgets and favorable regulatory environment for the expansion of small and medium enterprises are expected to encourage growth in both Asia Pacific and the United States.

Module Integration Segment to Hit $415.7M by 2026

Module integration refers to the integration of discrete devices and an enclosure into a common module. The integration of modules for PIC allows the integration of different optical functions and materials, as well as the combination of PIC and electronic IC functions seamlessly. In the global module integration segment, the United States, Canada, Japan, China and Europe will drive the estimated CAGR of 18.5% for this segment.

These regional markets representing a combined market size of US$128.2 million in 2020 will reach a projected size of US$397.4 million by the end of the analysis period. China will remain among the fastest growing markets in this group of regional markets. Led by countries such as Australia, India, and South Korea, the Asia-Pacific market is expected to reach US$33.7 million by 2026, while Latin America will expand to a CAGR of 21.7% over the analysis period.

Select competitors (total of 98 featured)

  • Broadcom Inc.

  • Ciena Corporation

  • Enablence Technologies, Inc.

  • Infinera Corporation

  • intel company

  • Lumentum LLC Operations

  • NeoPhotonics Company

  • Nokia Networks

Main topics covered




  • Impact of the COVID-19 pandemic and looming global recession: 2020 marked as a year of disruption and transformation

  • As the race between the virus and vaccines heats up, where is the global economy headed in 2021?

  • Impact of the pandemic on the integrated photonics market

  • Biosensors built around photonic integrated circuits offer new areas for point-of-care diagnostics

  • The era of optical communications and networks emphasizes high-speed photons as data carriers

  • An Introduction to the Photonic Integrated Circuit (PIC)

  • Materials used in the manufacture of the PIC

  • Integration models for PIC

  • Apps

  • Photonic Integrated Circuit (PIC): Current Market Scenario and Outlook

  • Substrate materials and fabrication methods for PICs

  • Indium phosphide: the largest and fastest growing type of material

  • Silicon substrates remain in contention

  • Hybrid Integration: The Widely Used PIC Manufacturing Method

  • Monolithic integration emerges as the fastest growing manufacturing approach

  • Analysis by application

  • Competitive scenario

  • Recent market activity

  • Select global brands



  • DCI’s Expanding Role in Data Centers Creates Potential Market Opportunities

  • Enterprise Data Center Interconnect (DCI) Needs by Industry: An Overview

  • Key Data Center Trends Influencing DCI Implementations

  • Rapidly growing data center traffic

  • Big Data and Cloud Computing Proliferate Demand for Large-Scale Data Centers

  • The PIC will benefit from the introduction of 5G

  • Programmable PICs offer huge potential to transform photonics

  • Optical communications: the largest application market for PIC

  • Key Trends Influencing PIC Adoption in the Optical Communication Space

  • Booming 100G and Ultra-100G OTN Deployments

  • Growing adoption of FTTx networks

  • Growing Bandwidth Needs Bring Fiber Optic Networks to the Forefront, Driving PIC Demand

  • Optical signal processing emerges as the fastest growing application segment

  • Biophotonics: a niche market segment for PIC

  • Expanding Application Base for Biophotonics Generates Parallel Opportunities for PIC

  • Increased focus on in vitro optical diagnostics bodes well

  • Biosensors built on SiN photonic integrated circuits

  • Northward trajectory in the vertical of fiber optic sensors provides impetus for market expansion

  • The concept of smart cities to support sales growth in the coming years

  • Smart homes to drive demand for ICPs

  • Advanced simulation software for designing PICs for automotive applications

  • Future quantum computing model to create new growth opportunities

  • Economic non-viability of electronic ICs in OEO conversion emphasizes photonic ICs

  • Photonic ICs vs Electronic ICs: A Brief Comparison Analysis

  • Reduced number of optical boxes and reduced need for fiber coupling improves the image of the PIC

  • Technological innovations: the key to strong growth and constant demand

  • An InP-on-Si-on-insulator monolith developed by a team of HKUST engineers.

  • Optoscribe begins sampling its new PIC coupling solution, OptoCplrLT

  • University of Rochester team creates miniature modulators for high-potential PICs

  • Purdue University research team develops magnetless, electrically driven linear optical isolator for PIC production

  • The Horizon 2020 INSPIRE project aims to combine the beneficial properties of two mature photonic integration platforms

  • Next-generation silicon photonics and polymer-based photonic ICs improve speed, bandwidth and scalability

  • Collaborative initiatives promote the development of innovative products

  • Challenges with PIC production




  • Total number of companies profiled: 84

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