KLA-Tencor Introduces New Metrology Systems for Advanced Integrated Circuit Device Technologies

“Manufacturers of advanced devices face extremely strict modeling specifications,” said Orestes Donzella, Marketing Director at KLA-Tencor. “To understand structuring errors, chipmakers need to quantify process variations, isolate their sources, and resolve underlying issues. The new metrology systems announced today generate critical data that engineers can use to specify detailed scanner corrections in the lithography module and process improvements in engraving, Our new overlay systems, from wafer geometry to Patterns, optical critical dimension and in situ temperature measurement play key roles in driving the performance of 193i multi-patterns and the basis of early EUV lithography results.

Archer 600 Extends Imaging-Based Overlay Metrology Technology With New Optics and Measurement Targets, Helping Chipmakers Achieve Less Than 3nm Overlay Error for Logic and Memory Devices advances. Innovative ProAIM ™ targets provide better resilience to process variations and improved correlation between target and device overlay errors, producing more accurate overlay measurements. New optical technologies in the Archer 600, including a higher brightness light source and polarization module, allow tighter overlay error feedback and control over a range of process layers, from thin resins to opaque hard mask materials. With improved productivity, the Archer 600 supports increased sampling of overlay errors for improved scanner corrections or identification of line excursions. Several Archer 600 systems are already measuring the most advanced devices from foundry, logic and memory manufacturers around the world.

The WaferSight PWG2 produces comprehensive wafer stress and shape uniformity data, enabling monitoring and matching of processing tools for film deposition, annealing, etching, and other processing modules. With significant productivity improvements, the WaferSight PWG2 promotes increased sampling of production wafers, helping chipmakers identify and correct for process-induced wafer stress variations that can lead to patterning and patterning issues. yield. WaferSight PWG2 wafer shape data can also be transmitted to the lithography scanner to correct for overlay errors due to wafer stress, a particular concern for 3D NAND devices, which use stacks of thick film that can distort the wafer. platelets. With industry-unique vertical wafer hold, the WaferSight PWG2 simultaneously measures the front and back surfaces of wafers, generating wafer flatness and topography measurements that can improve scanner focus prediction and control. . Several WaferSight PWG2 systems are installed at advanced integrated circuit manufacturers, where they are used in development for lithography control and in high volume manufacturing to optimize and monitor a wide range of manufacturing processes.

The SpectraShape 10K optical metrology system measures CDs and three-dimensional shapes of complex IC device structures after etching, chemical-mechanical planarization (CMP) and other process steps. To comprehensively characterize the structures of the device, the SpectraShape 10K utilizes a wide range of optical technologies, including a new polarization capability and multiple angles of incidence for the ellipsometer, as well as a new high light source. brightness with TruNI ™ illumination for the reflectometer. These technologies allow precise measurement of many critical parameters associated with FinFET and 3D NAND devices, such as CD, height, SiGe shape and arc profile of the channel hole. With higher throughput than its predecessor, the SpectraShape 10K facilitates the increased sampling required for tighter process control and growth in the number of process layers through multi-model techniques. The SpectraShape 10K has been strongly adopted by foundries for FinFET and multi-model integration, with additional systems supporting advanced 3D NAND manufacturing from all major memory manufacturers.

Using in situ measurements, the SensArray HighTemp 4mm wireless wafer provides temporal and spatial temperature information for advanced film processes. With a thinner wafer profile than its predecessor, the SensArray HighTemp 4mm is compatible with a wider range of processing tool types, including track, strip and physical vapor deposition (PVD) systems . With a temperature range of 20 to 400 ° C, the SensArray HighTemp 4mm enables process characterization and tool qualification by mapping thermal variations that can affect process windows and modeling performance. Several SensArray HighTemp 4mm inserts are used by microprocessor, DRAM and 3D NAND manufacturers for routine process tuning and monitoring of film applications.

The Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm are integrated into KLA-Tencor 5D® Analyzer advanced data analysis system, which supports real-time process control and provides tools for engineering monitoring and analysis. To maintain the high performance and productivity demanded by integrated circuit manufacturing, the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm are supported by KLA-Tencor’s comprehensive global service network. More information about the four new systems can be found on the website 5D Modeling Control Solution Web Page.

About KLA-Tencor:
KLA-Tencor Corporation, a leading provider of process control and performance management solutions, partners with customers around the world to develop advanced inspection and metrology technologies. These technologies serve semiconductors, LEDs and other related nanoelectronic industries. With an industry-standard product portfolio and a team of world-class engineers and scientists, the company has created superior solutions for its customers for over 40 years. Based at Milpitas, California, KLA-Tencor has dedicated customer service and operations centers around the world. Additional information can be found at www.kla-tencor.com (KLAC-P).

Forward-looking statements:
Statements in this press release other than historical facts, such as statements regarding the expected performance of the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm systems; extension of the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm systems to future technology nodes; the intended uses of the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm systems by KLA-Tencor customers; and anticipated costs, operational and other benefits achievable by users of the Archer 600, WaferSight PWG2, SpectraShape 10K and SensArray HighTemp 4mm systems, are forward-looking statements and are subject to the safe harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations and involve a number of risks and uncertainties. Actual results may differ materially from those projected in these statements due to various factors, including delays in adopting new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unforeseen technological challenges or limitations. that affect the implementation, performance or use of KLA-Tencor products.

SOURCE KLA-Tencor Corporation

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